Tlhahlobo ea mmaraka: Chelete e felletseng ea lijalo tse kholo tse tharo tsa ho paka le ho hlahloba naheng ea China e lebelletsoe ho eketseha ka 8% ka 2020
Ho ea ka litlaleho tsa litaba tsa Taiwan, ka lebaka la ntoa ea khoebo ea Sino-US le mabaka a mang, lekhetho le felletseng la baetsi ba lihlahisoa tse tharo tsa China le tsa polokeho ea OEM (OSAT) ho kenyelletsa JCET Group Co, Ltd, Tongfu Microelectronics, le Huatia Technology ka 2019 e bile RMB 39,9 bilione. , Keketseho ea selemo le selemo ea 4% feela. Leha ho le joalo, mohlahlobi oa lipatlisiso tsa DIGITIMES Chen Zejia o bolela esale pele hore selemong sena, se khannoang ke 5G le lits'ebetso tse ncha, lekhetho lohle la lik'hamphani tse tharo tse kaholimo le tla hola ka 8%.
Leha ho hloka botsitso ha seoa sa COVID-19 ka 2020 le papali ea Sino-US se ntse se le teng, empa se ruile molemo ho tsoa ho 5G le lits'ebetso tse ling le lisebelisoa tse ncha, melaoana e ikemetseng ea semiconductor le lintlha tse ling, mohlahlobi oa lipatlisiso tsa DIGITIMES Chen Zejia o hakantse hore OSAT ea pele e meraro e kholo barekisi naheng ea boholo-holo China lekhetho lohle le tla hola ka 8%; mabapi le sebopeho sa tekheniki, bahlahisi ba kaholimo ba tla shebana haholo le theknoloji ea ho paka ea 2,5D / 3D e amanang le lits'ebetso tse hlahang tse kang 5G.
Chen Zejia o boletse hore lekhetho lohle la baetsi ba bararo ba mantlha ba OSAT naheng ea Chaena e tla eketseha feela ka 4% ka selemo sa 2019. Ntle le tšusumetso ea lisosa tse kholo tsa tikoloho joalo ka ntoa ea khoebo ea Sino-US le indasteri e monyebe ea semiconductor, JCET Sehlopha Motlatsi oa tšehetso ea Co, Ltd. Starco Jinpeng Ho theoha ha lekeno la khoebo la ho paka le ho lekola joalo ka liselefounu tsa mohala oa thekeng, memori le li-cryptocurrencies le tsona li huletse chelete ea selemo le selemo ea JCET 'me ea eba lebaka feela la kholo e mpe ea ba bararo bahlahisi ba ka sehloohong; ha Tongfu Microelectronics le Huatia Technology li ruile molemo ho li-chips tse ncha tsa bareki Lits'ebetso tse joalo ka lenane le ho hokahana le tse fumanoeng li fihletse kholo ea chelete ea habeli ea selemo.
Leha lefu la seoa le keketseho ea tlholisano lipakeng tsa China le United States li tla tlisa chelete e sa tsitsang ea chelete ea baetsi ba OSAT ba China ka 2020, tlhoko ea nako e khuts'oane ea li-chips tse tlisoang ke lefu la seoa le ho romelloa ha lifono tsa 5G butle-butle li ntse li eketseha butle-butle. Ho aha litsi tsa metheo ea 550,000 5G, hammoho le leano la China la boipuso ho li-semiconductors, Patlisiso ea DIGITIMES e lebelletse hore lekhetho lohle la barekisi bana ba meraro ba OSAT le tla nyoloha ka 8% selemo le selemo ka 2020.
Ntle le moo, mabapi le sebopeho sa botekgeniki, DIGITIMES Patlisiso e bontšitse hore baqapi ba IC le baetsi ba liteko naheng e ngoe Chaena ba khonne ho hlahisa thepa-in-package (SiP), setsi sa fan-out (fan-out), Flip- sephutheloana sa chip (Flip Chip; FC) le ka silicon ka (TSV) le mahlale a mang a hatetseng pele a ho paka. Leha ho le joalo, ka lebaka la litlhoko tsa 5G le lits'ebetso tse ling tse hlahang bakeng sa mesebetsi e fapaneng le ts'ebetso e phahameng ea lisebelisoa tsa elektroniki, chip e hloka ho kopanngoa haholo, kahoo chip e lebisa ho nts'etsopele ea sebopeho sa mekhahlelo e meraro, le naha Baetsi ba Chaena le bona ba tla latela mokhoa oa ho nyolla sebopeho le sepheo sa 5G, khomphutha e sebetsang hantle (HPC), memori, sensors, menyetla ea likoloi le menyetla e meng ea kopo.
Chen Zejia o boletse hore lekhetho lohle la baetsi ba bararo ba mantlha ba OSAT naheng ea Chaena e tla eketseha feela ka 4% ka selemo sa 2019. Ntle le tšusumetso ea lisosa tse kholo tsa tikoloho joalo ka ntoa ea khoebo ea Sino-US le indasteri e monyebe ea semiconductor, JCET Sehlopha Motlatsi oa tšehetso ea Co, Ltd. Starco Jinpeng Ho theoha ha lekeno la khoebo la ho paka le ho lekola joalo ka liselefounu tsa mohala oa thekeng, memori le li-cryptocurrencies le tsona li huletse chelete ea selemo le selemo ea JCET 'me ea eba lebaka feela la kholo e mpe ea ba bararo bahlahisi ba ka sehloohong; ha Tongfu Microelectronics le Huatia Technology li ruile molemo ho li-chips tse ncha tsa bareki Lits'ebetso tse joalo ka lenane le ho hokahana le tse fumanoeng li fihletse kholo ea chelete ea habeli ea selemo.
Leha lefu la seoa le keketseho ea tlholisano lipakeng tsa China le United States li tla tlisa chelete e sa tsitsang ea chelete ea baetsi ba OSAT ba China ka 2020, tlhoko ea nako e khuts'oane ea li-chips tse tlisoang ke lefu la seoa le ho romelloa ha lifono tsa 5G butle-butle li ntse li eketseha butle-butle. Ho aha litsi tsa metheo ea 550,000 5G, hammoho le leano la China la boipuso ho li-semiconductors, Patlisiso ea DIGITIMES e lebelletse hore lekhetho lohle la barekisi bana ba meraro ba OSAT le tla nyoloha ka 8% selemo le selemo ka 2020.
Ntle le moo, mabapi le sebopeho sa botekgeniki, DIGITIMES Patlisiso e bontšitse hore baqapi ba IC le baetsi ba liteko naheng e ngoe Chaena ba khonne ho hlahisa thepa-in-package (SiP), setsi sa fan-out (fan-out), Flip- sephutheloana sa chip (Flip Chip; FC) le ka silicon ka (TSV) le mahlale a mang a hatetseng pele a ho paka. Leha ho le joalo, ka lebaka la litlhoko tsa 5G le lits'ebetso tse ling tse hlahang bakeng sa mesebetsi e fapaneng le ts'ebetso e phahameng ea lisebelisoa tsa elektroniki, chip e hloka ho kopanngoa haholo, kahoo chip e lebisa ho nts'etsopele ea sebopeho sa mekhahlelo e meraro, le naha Baetsi ba Chaena le bona ba tla latela mokhoa oa ho nyolla sebopeho le sepheo sa 5G, khomphutha e sebetsang hantle (HPC), memori, sensors, menyetla ea likoloi le menyetla e meng ea kopo.