Google e lipuisanong le Marvell ho nts'etsapele li-chips tse peli tsa AI, ka tlhahiso ea lifofane e lebelletsoeng ka 2027.
2026-04-21Ka la 19 Mmesa, 2026 (nako ea lehae), litlaleho tsa mecha ea litaba tse qotsang mehloli e tloaelaneng le taba ena li senotse hore Google, e leng setsi...
Theknoloji ea Phatlalatso ea Phanele ea Boemo ba TSMC e Tsoelang Pele;CoPoS Pilot Line e Lebeletsoe ho phetheloa ka Phuptjane
2026-04-15Ho ea ka * The Business Times *, TSMC's CoPoS (Chip-on-Panel-on-Substrate) mohala oa tlhahiso ea lifofane o qalile ho fana ka lisebelisoa ho sehlopha ...
Balekane ba Anthropic le Google le Broadcom ho Fetisa Li-Gigawatt tse 'maloa tsa li-TPU tsa Next-Generation
2026-04-08Ka la 6 Mmesa nakong ya lehae, seqhenqha sa mahlale sa U.S. Anthropic se phatlalalitse hore se saenetse tumellano e ntjha le Google le Broadcom ya ho ...
Microsoft e Phatlalatsa Matsete a Libillione tse 5.5 ho Atolosa Cloud le AI Infrastructure ho la Singapore
2026-04-03Ka la 1 Mmesa, Microsoft e phatlalalitse hore e tla tsetela $ 5.5 bilione ho Singapore ho tsoela pele ho holisa lisebelisoa tsa eona tsa maru le bohla...
Samsung e fihletse tumellano e khethehileng ea phepelo ea HBM4 le OpenAI, 'me bophahamo ba thepa bo ka bang 15%
2026-03-24Samsung Electronics e tla ba ea pele ea ho fana ka HBM4 ea moloko o latelang ho OpenAI, k'hamphani e kholo ka ho fetisisa lefatšeng ea bohlale ba mai...
Ho shebana le 'Maraka o Tsoetseng Pele oa Packaging: ASML e tlalehoa e le ho nts'etsapele lisebelisoa tsa Hybrid Bonding.
2026-03-19Ho latela menyenyetsi ea indasteri, kamora ho phatlalatsoa ha morao tjena ha lits'ebetso tse peli tsa lithography tse etselitsoeng 'maraka o tsoetseng...
Basebetsi ba Applied Materials le SK Hynix le Micron ho Ntlafatsa Memory Chips
2026-03-12Ka Labobeli la Nako ea Bochabela, Applied Materials e phatlalalitse hore e sebelisane le lik'hamphani tsa memori tsa Micron Technology le SK Hynix ho ...
Meta e rera ho nts'etsapele lichifi tsa tloaelo ka ho khetheha bakeng sa koetliso ea AI
2026-03-05Phatlalatso ea 5th ea March: Meta Platforms Inc. Mookameli oa Lichelete (CFO) Susan Lee o boletse sebokeng sa theknoloji se tšoaroang ke Morgan Stanl...
ASML e Rera ho Holisa Mohloli oa Leseli oa EUV ho isa ho 1000W, ho Eketsa Matla a Tlhahiso ea Wafer ka 50%
2026-02-25Ho ea ka Reuters, Dutch lithography equipment giant ASML e fihletse katleho e ncha ea bohlokoa ho theknoloji e feteletseng ea ultraviolet (EUV), e rer...
imec E Tseba 2nm-Class Chip Pilot Line ka Matsete a Libillione tse 2.5, e Fumana Sistimi e Phahameng ea NA EUV Lithography ka Hlakubele
2026-02-11Setsi sa lipatlisiso sa Belgian imec e phatlalalitse ho thakholoa ha mohala oa eona oa tlhahiso ea "NanoIC", o reretsoeng ho nts'etsapele li-semicondu...
Ho fihlela tlhoko ea NVIDIA, Samsung le SK Hynix ho tlalehoa li potlakile ho hlahisa HBM4 e ngata pele tlhahlobo e phetheloa.
2026-02-04Ho latela ZDNet Korea, kemiso ea nako ea tlhahiso e kholo ea High Bandwidth Memory (HBM) e ntse e ngoloa bocha.Ka tloaelo, lihlahisoa tsa semiconducto...
Micron ho Holisa Memory Chip Capacity ho Singapore Plant ka $24 Billion Investment
2026-01-29Ho sebetsana le khaello ea memori ea memori e tsamaisoang ke tlhoko ea bohlale ba maiketsetso (AI), Micron Technology e phatlalalitse hore e tla tsete...