Theknoloji ea Phatlalatso ea Phanele ea Boemo ba TSMC e Tsoelang Pele;CoPoS Pilot Line e Lebeletsoe ho phetheloa ka Phuptjane

Ho ea ka * The Business Times *, TSMC's CoPoS (Chip-on-Panel-on-Substrate) mohala oa tlhahiso ea lifofane o qalile ho fana ka lisebelisoa ho sehlopha sa eona sa R & D ka February, 'me mohala oohle o lebelletsoe ho sebetsa ka botlalo ka Phuptjane.

The Business Times e hlokometse hore ho phahama ha theknoloji ea CoPoS ho totobatsa phetoho ea indasteri ho ea ho phanele, ho e nka e le tharollo ea bohlokoa ho libotlolo tse tsoetseng pele tsa ho paka: ha litekanyo tsa photoresist tsa li-chips tsa AI li ntse li eketseha - ka mohlala, NVIDIA's Rubin GPU e se e le kholoanyane ka makhetlo a 5.5 ho feta pele - sephaphatha se tloaelehileng sa 12-inch se se se ka amohela linyeoe tse supileng, tse 'maloa feela.Tlaleho e bolela hore sebopeho sa "square panel" se ka ntlafatsa haholo ts'ebeliso le tlhahiso, ka sepheo sa nako e telele sa ho nkela li-interposer tsa silicon sebaka ka li-substrates tsa khalase.

Ho ea ka Business Times, ka mohala oa tlhahiso ea lifofane oa TSMC oa CoPoS o lebelletsoeng ho phethoa bohareng ba selemo, indasteri ka kakaretso e lebelletse hore tlhahiso ea bongata e tla qala butle-butle pakeng tsa 2028 le 2029. Leha ho le joalo, mehloli ea phepelo e boletsoeng tlalehong e boetse e hlokomelisa hore ha boholo ba substrate bo ntse bo eketseha, mathata a warpage a ntse a eketseha, a fetoha e 'ngoe ea litšitiso tse kholo ka ho fetisisa.

Ho sa le joalo, Central News Agency e hlokometse hore TSMC e ka theha mohala oa eona oa pele oa sefofane oa CoPoS Chiayi mme e rera ho etsa tlhahiso ea bongata sebakeng seo, ka litebello tsa ho kopanya bokhoni ba CoPoS, SoIC (System-on-Chip) le WMCM (Wafer-Level Multi-Chip Module).

CNA e tlaleha hore TSMC e boetse e rera ho fetolela masela a 8-inch a Taiwan hore e be meaho e tsoetseng pele ea ho paka, athe masela a morao-rao a morao-rao a tla ts'ehetsa tlhahiso ea lits'ebetso tsa 2nm.