CoWoS Packaging E hlalositsoeng: CoWoS-S vs. CoWoS-R vs. CoWoS-L, HBM, Manufacturing, le AI Chips
2026-08-03 599

CoWoS, kapa Chip-on-Wafer-on-Substrate, e kopanya logic dies, chiplets, le high-bandwidth memory ka hare ho package e kholo. E fa mefuta e mekoe, e habelitsoeng ea ho hokahanya e tšehetsang phetoho e potlakileng ea data lipakeng tsa computation le memory. CoWoS-S e sebelisa silicon interposer e kholo bakeng sa ho rera haholo-holo sebakeng se senyenyane. CoWoS-R e nka sebaka sa interposer e feletseng ea silicon ka multilayer RDL, ha CoWoS-L e kopanya RDL routing le interconnects tse nyenyane tsa silicon feela moo ho hlokahala ho etsa meeli e mekoe haholo. Versiyon e 'ngoe le e 'ngoe e fa lebaleng le fapaneng la ho rera haholo-holo, boholo ba package, tšebeliso ea silicon, theko, le borai ba ho etsa.

Catalog

What Is CoWoS Packaging and How Does It Work?

CoWoS, kapa Chip-on-Wafer-on-Substrate, ke theknoloji e ntlafetseng ea ho paka e behang die tse ngata tse amanang le logic le high-bandwidth memory (HBM) ka haufi ho feta ka hare ho package e tšoanang. E sebelisoa haholo bakeng sa AI accelerators, high-performance computing processors, networking chips, le mekhahlelo e meng e hlokang high memory bandwidth le ho potlaka ho fetola khokahano pakeng tsa die.

Sebakeng sa ho romella matšoao lipakeng tsa lipakete tse arohaneng ka mofuta o molemohali oa PCB, CoWoS e sebelisa silicon interposer, redistribution-layer interposer, kapa local silicon interconnect ho theha khokahano e ngata ea motlakase pakeng tsa logic die le HBM. Khamphani ena e khutšoanyane e tšehetsa mekhahlelo e mane e mengata, ho fokotsa latencies ea ho buisana, le ho fokotsa tšebeliso ea matla ea interconnect.

Karolo ea interconnect e hokahanya tlase ho substrate ea package. Substrate e aba matla le motheo, e tsamaisa matšoao a kantle, le ho hokahanya sebopeho se felletseng sa CoWoS le PCB ea sistimi.

Ts'ebetso e kholo ea data ea processor-to-memory ke:

HBM ↔ interposer, RDL, kapa LSI ↔ logic die

Khokahano ea package-to-system e latela tsela e arohaneng:

Logic die le structure ea interconnect → substrate ea package → PCB

Kamoo Logic Dies, HBM, le Substrate ea Package li Amanang

Logic die e sebetsa mesebetsing e amanang le computation, ha HBM stacks e fa memory e phahameng ka kapa ka khona ho latela matšoao a sebakeng. Ho latela CoWoS architecture, puisano lipakeng tsa bona e entsoe ka ho fetisoa ho interposer e feletseng ea silicon, interposer e kholo ea RDL, kapa local silicon interconnects tse behiloeng feela moo ho hlokahalang ho rera.

Substrate ea package e hokahanya package ea CoWoS le PCB le ho tsamaisa matla, motheo, matšoao a taolo, le I/O ea kantle.

Package Element	Main Function	Main CoWoS Use
Logic die	E etsa AI, HPC, networking, kapa general compute processing	Mefuta eohle ea CoWoS
HBM stack	E fa bolaoa e phahameng, kh速度ia phahameng hara processor	AI le HPC liphutheloana
Silicon interposer	E fa mokhoa o nonneng ho feta sebaka se pharaletseng se sebetsang	Haholo-holo CoWoS-S
RDL interposer	E fa mokhoa o pharaletseng oa.Signal le matla ho boloka mokhoa o feletseng oa silicon interposer	CoWoS-R le CoWoS-L
Local Silicon Interconnect	E fa mokhoa oa silicon-selemong ho lisebelisoa tse khethiloeng tse nonneng	CoWoS-L
Substrate ea phutheloana	E fumana CoWoS ho bokhoni ba tsamaiso, motheo, I/O, le PCB	Mefuta eohle ea CoWoS

Hobane'ng ha CoWoS e Sebelisoa bakeng sa AI, HPC, le HBM?

Setšoantšo sa 2. Processor ea AI e nang le HBM Stacks tse ngata

LI-accelerators tsa AI le li-processor tsa HPC li tlameha ho ntse li ferekanang le mefuta e mebedi ea data pakeng tsa compute dies le memory. HBM e fa sebaka sena sa bandwidth ka sehokelo se pharaletseng, empa e hloka likhokelo tse sekete tse haufi. CoWoS e beha li-HBM stacks vedis morala hou, e sebelisa mokhoa o nonneng boholo ba phutheloana ho boloka likhokelo tsena li khutsoe.

Mokhoa ona o thusa ho fokotsa ho lieha ha lintlha, tahlehelo ea matla a interconnect, le bothata ba ho routing bo ka etsahalang haeba processor le mehloli e be le litaelo tse ikgethang. Hape e lumella li-HBM stacks tse 'maloa ho sebetsa hammoho, e fafatsa processor ka bandwidth e phahameng ho feta mehloli e tloaelehileng ea kantle.

CoWoS hape e sebetsa ha moralo o kenyelletsa logic dies tse khōlō, chiplet tse ngata, kapa li-HBM stacks tse 'maloa. Phutheloana e tloaelehileng e kanna e sitwa ho fana ka botebo bo lekaneng ba routing kapa sebaka se sebelisitsoeng sa phutheloana bakeng sa li-components tsena. CoWoS e etsa sebopeho se seholo sa kopano ha e ntse e boloka likhokelo tse ntle pakeng tsa li-dies.

Lihlopha tsa nnete, CoWoS e khethoa ha processor e hlokahala bandwidth ea memory e phahameng haholo, li-HBM stacks tse 'maloa hara compute die, likhokelo tse khutšoanyane le pharaletseng die-to-die, ts'ehetso bakeng sa li-die tse kholo kapa chiplets tse ngata, le matla a tlase a interconnect ho feta mokhoa oa phutheloana ho phutheloana.

Monyetla o moholo ke ho se hlomelle mabitso a mangata ho phutheloana e le 'ngoe. CoWoS e fa thepa e nonneng ea interconnect e hlokahalang ho boloka li-processor tse matla AI le HPC li na le data ka ho sa feleng.

CoWoS-S vs. CoWoS-R vs. CoWoS-L

Setšoantšo sa 3. CoWoS-S vs CoWoS-R vs CoWoS-L

CoWoS-S, CoWoS-R, le CoWoS-L li sebelisa mekhahlelo e fapaneng ea interconnect ho hokahanya logic dies, li-HBM stacks, le substrate ea phutheloana. Phapang e kholo ke hore na silicone e sebelisitsoe hakae le hore na ho routing density e phahameng ka ho fetisisa e fumaneha hokae.

Fakete ea Phetho	CoWoS-S	CoWoS-R	CoWoS-L
Mofuta oa interconnect o felletseng	Silicon e kholo interposer	RDL e ngata interposer	RDL interposer e nang le litlhaku tsa silikon tse haufi
Density ea Routing	E phahameng haholo ho pharaletseng sebakeng se sebetsang	E tlase ho silicon empa e loketse ho routing e pharaletseng ea phutheloana	E phahameng haholo ho li-interface tse khethiloeng
Tšebeliso ea Silicon	E sebelisa sebaka se seholo sa silicon ka tlase ho li-dies tse sebetsang	Ha e hloke interposer e felletseng ea silicon	E sebelisa silicon feela moo ho hlokahalang ho routing e ntle-pitch
Tšebeliso ea TSV	Li-TSV li fa likhokelo tse phahameng ho interposer ea silicon	Ha e ieo phoso ho interposer e kholo ea TSV	E sebelisa RDL routing e nang le structures tsa interconnect tsa silicon tse khethiloeng
Sekala sa Phutheloana	E lekanyelitsoe ke ho rarahana ho etsa interposer e kholo, boholo, le yield	E tšehetsa likarolo tse kholo tse amanang le RDL	E tšehetsa liphutheloana tse kholo ha e ntse e boloka likhokelo tse nonneng
Boitšoaro ba Mechini	Moralo o matla oa silicon, o hloka tlhokomelo e khethiloeng ho hohla le ho ts'oara	Moralo o bonolo oa polymer-RDL	E kopanya RDL compliance le libaka tsa silicon tse haufi
Monyetla o Moholo	E fa botebo bo pharaletseng ba routing ea silicon	E fa routing e kholo ka bolokolohi bo fokolang ba silicon	E balanse boholo bo boholohali ba liphutheloana le botebo bo phahameng ba routing ba lehae
Moeli o Moholo	Litšenyehelo tse phahameng, sebaka sa silicon, ho rarahana ho etsa, le kotsi ea yield	Density ea routing e tlase ho feta ea silicon interposers	Ho thatafala ho kopanya RDL le li-interconnect tsa local silicon
Sebaka se Sopho	Routing e ngata hoc-ea-HBM ho pharaletseng sebakeng sa phutheloana	Phutheloana e khōlō ho etsoa ha density ea RDL e lekaneng	Li-pakete tse kholo tsa AI le HPC tse hlokang ho fetisetsa haholo feela ho li-interface tse khethehileng

CoWoS-S

CoWoS-S e sebelisa interposer ea silicon ka tlase ho logic dies le HBM stacks. Li-metal layers tse ntle ho interposer li fa mekhahlelo ea ho fetisetsa ka ho dikai.

TSVs li feta ka botebo ho interposer ea silicon 'me li hokela routing ea eona holimo ho bumps ka tlase ho eona. Mekhahlelo ena e ka botebong e thepa, lefatše, le liphusho tsa kantle ho substrate ea package.

Hobane interposer e entsoe ka silicon, e ka tšehetsa wiring e finyane ho feta sebopeho sa RDL se thehiloeng ho polymer. Sebaka se kholo se amanang le interposer se hloka sebaka se eketsehileng sa silicon 'me se bakoa sefahleho se seholo ho litlhoko tsa ho sebetsa. Boholo ba interposer bo ka ama litšenyehelo, phallo, le ho se tshepehe ho package.

CoWoS-R

CoWoS-R e nkela sebaka sefele sa interposer ea silicon ka sebopeho sa RDL sa multilayer. Li-copper traces li etsoa ka har'a li-layer tsa polymer dielectric ho fa liphusho, thepa, le lefatše ho feta package.

Ho fetisetsa ha RDL ha ho hlokahale ho TSVs ka holimo ho sefofane se kholo. Mekhahlelo e ka botebong e thehoa ka har'a vias pakeng tsa li-layer tsa RDL le ka ho tsoa ho bumps ho ea ho dies le substrate ea package.

Sebopeho sena se lumella sebaka sa ho hokela hore se pharalle ntle le ho etsa interposer e kholo haholo ea silicon. Le fa ho joalo, bolelele ba RDL, sebaka, le boholo ba vias hangata bo kholo ho feta boo bo fumanehang ho silicon, kahoo ha e khone ho fa density e tšoanang ea routing ho li-interface tse hlokang haholo.

CoWoS-L

CoWoS-L e kopanya ho fetisetsa ha RDL ka Local Silicon Interconnects, kapa LSIs. Li-layer tsa RDL li sebetsana le ho hokela ho pota-pota package e kholo, ha libaka tse nyenyane tsa silicon li behiloe haufi le li-interface tse hlokang wiring e finyane.

LSI e sebetsa joalo ka borai ba silicon bo amanang eseng interposer e feletseng. E hokela dies e haufi ka li-traces tse ntle le tse khuts'oane. Sena se etsa hore e be molemo bakeng sa li-interface tse tšepisang logic-to-HBM kapa die-to-die ntle le ho beha layer e kholo ea silicon ka tlase ho borai bo feletseng.

Li-structure tsa RDL le LSI li tlameha ho sehlopha le ho hokahana ka nepo nakong ea ho etsa. Sena se hlahisa mehato e mengata e amanang le ho sebelisa feela interposer ea silicon kapa RDL feela.

Khetho e ipapisitse le palo ea HBM, boemo ba die, pitch ea interface, sebaka sa package, phekolo ea matla, ho futhumatsa, ho se tshepehe, litšenyehelo, le phallo ea tlhahiso.

CoWoS-S e loketse mehopolo e hlokang ho fetisetsa ka silicon e amanang ka sebaka se sepho. CoWoS-R e loketse haholo ha package e kholo e ka sebetsa ka ho fetisetsa ha RDL. CoWoS-L e sebelisoa ha boholo ba package bo ka ts'epa ho RDL, empa li-interface tse khethehileng li ntse li hlokang ho hokahana hoa silicon.

Mokhoa oa ho Etsa CoWoS Packaging

Setšoantšo sa 4. Mekhoa ea Ho Etsa CoWoS

Ho etsa CoWoS ho kenyelletsa ho theha ho hokela le diphetho tsa dies tse tsebahalang, ho beha le ho tšoaea logic dies le HBM, ho phethisa mekhahlelo ea mechini le ea motlakase, le ho leka package e phethiloeng. Lintlha tse nepahetseng tsa ho etsa li fapana le meralo ea CoWoS, empa ho kopanngoa ha borai ho tšoana.

Mosebetsi oa Tlhahiso	Seo Se etsahalang
Ho etsa ho hokela	Interposer ea silicon, sebopeho sa RDL, kapa sebopeho sa RDL le LSI se etsoa ka routing e hlokahalang ea liphusho, thepa, le lefatše. Mekhahlelo e ka botebong le li-structure tse entsoeng li also thehoa moo ho hlokahalang ho qetella sebopeho sa package.
Tlhahlobo ea known-good-die	Logic dies, HBM stacks, le chiplets li lekantsoe ka motlakase pele ho borai. Ho khetholla di-die tse jeoang pele ho tšoaea ho bohlokoa hobane karolo e le 'ngoe e felletseng e ka fokotsa phallo ea package e phethiloeng ea multi-die.
Boemo ba Die	Logic dies, HBM stacks, le chiplets tse ling li behiloe ka nepo haholo holim'a libaka tseo li amanang le tsona. Boemo bo becomes more demanding ha bump pitch e fokotseha le palo ea dies e eketseha.
Ho tšoaea Die	Li-dies li tšoarang ho sebopeho sa ho hokela se lokiselitsoeng ka micro-bumps kapa likhokahano tse ling tse ntle. Boleng ba bond, ho kopanya, ho tenyetseha ho amanang, le boemo ba borai bo lokela ho laoloa ka hloko.
Underfill le molding	Underfill e kenngoa ka lebaka la li-joints tse ntle ho ts'ehetsa likhokahano le ho fokotseha ho matla a mekhahlelo. Lihlahisoa tse notetsi le tsona li ka sebelisoa ho latela sebopeho sa package ho sireletsa le ho kopanya borai.
Ho kopanya substrate	Borai bo phethiloeng ba die le ho hokela bo hokeloa ho substrate ea package, hangata ka ho itukisetsa li-bump tse kholo joalo ka C4 bumps. Substrate e fa thepa, lefatše, le I/O ea kantle ho PCB ea tsamaiso.
Ho qetela ho mekiniki le ho futhumatsa	Mechahlo, lifa, sebapali sa mocheso, lisebelisoa tsa mocheso, le likarolo tse ling tsa struktura li kenyelletsoa ha ho hlokahala. Ho ba le diphetoho, khatello ea mechini, le ntlafatso ea mocheso ho lokela ho laoloa hohle ho potoloha potoloho e kholo.
Tlhahlobo ea bokhuti ba elektrone	Phakete e felileng e hlahlojoa bakeng sa ho sebetsa ha logic, puisano ea HBM, ho khanna ho kopaneng, ho fa matla, I/O e kantle, le liketso tse ling tsa elektrone.
Tlhahlobo ea ts'epahalo	Liphakete li ka feta mekhahlelo ea mocheso, tlhahlobo ea mofuthu, tlhahlobo ea khatello ea mechini, le mekhahlelo e meng ea netefatso ho hlahloba likhechana tsa solder, mekhoa e amanang, diphetho, le ts'epahalo ea nako e telele.

Khokahano ea mantlha ea tlhahiso ke:

Ho etsa ho khokahana → tlhahlobo ea die e tsebahalang → ho beha die → ho hlama die → ho nka sebaka kapa ho fetolela → ho amanang le substrate → ho qeta mechini le mocheso → tlhahlobo ea ho qetela.

Melemo le Likhatello tsa CoWoS

CoWoS e fana ka bokhoni bo phahameng ba ho khokahana pakeng tsa logic dies, HBM, le chiplets. Likhoele tse khuts'oane, tse fine-pitch li ts'ehetsa litsela tse kholo tsa data le bandwidth e phahameng ea memory. E boetse e lumella ho kopanya logic, memory, le I/O dies tse entsoeng ka theknoloji e fapaneng ho pakete e le 'ngoe.

Tlhōlo e kholo ke ho thatafala haholo ha ho kopanya. Ha boholo ba phakete, naka ea die, le naka ea HBM e ntse e eketseha, theko ea tlhahiso, kotsi ea yield, le bothata ba tlhahiso li ntse li eketseha.

Ts'ebetso ea mocheso e lekanyetsoa ka mocheso oa junction, hotspots, resistance ea mocheso, le karolelano ea mocheso ho potolohong ea logic dies le HBM. Ho futhumala ho sa lekanang ho ka boela ha eketsa phokotso ea phakete hobane silicon, koporo, likhomphuthara tse entsoeng, le lisebelisoa tsa substrate li pharalla ka mekhahlelo e fapaneng.

Botsitso ba matla bo lekanyetsoa ka PDN impedance, IR drop, voltage droop, overshoot, le lefu la matla. Opposition le inductance ho bumps, vias, RDLs, wiring ea interposer, le amanang le substrate li ka ama stability ea rail. Lokisetsa le capacitors e tsitsitseng ka tlung, kapa DTCs, li ka fana ka chaja haufi le logic die le ho fokotsa power-delivery impedance nakong ea phetoho e potlakileng ea motlakase.

Botsitso ba sesupo bo itšetlehile ka resistance, capacitance, le inductance ea TSVs, RDL traces, micro-bumps, le ho lebisa phakete. E lekanyetsoa ka ho hlahiswa ha lahleheloa, ho khutla ha lahleheloa, crosstalk, ho bula mahlo, jitter, le moeli oa nako.

Ts'epahalo e leka ka thermal cycling, ho lekanya liphetho, bump strain, ho ts'epahala ha khokahano, le ho hlahlojoa ha ho se sebetse. Ho futhumetse le ho qhibiliha bocha ho ka ama mikro-bumps le C4 joints, ho lebisa ho solder fatigue, cracking, kapa delamination.

K χρήση και ως δεν στην CoWoS

CoWoS e sebelisoa haholo ho AI accelerators, HPC processors, networking ASICs, le lisebelisoa tse thehiloeng ho chiplet tse hlokang HBM kapa ho kopanya ho ngata.

Mehlala ea Chips le ASICs a Sebelisang CoWoS

• NVIDIA Hopper: H100-class e amanang le GPU ea data-center ea NVIDIA, e kopanyang GPU e kholo le HBM bakeng sa mesebetsi ea AI le HPC. Ka January 2025, CEO ea NVIDIA Jensen Huang o netefalitse hore tlhahiso ea Hopper e sebelisa CoWoS-S.

NVIDIA Blackwell: Blackwell e fa phakete botsitso bo tšoanang ka ho sebelisa die e ngata e kholo ka kopo le HBM. Huang o boletse hore NVIDIA e tla sebelisa haholo CoWoS-L ha tlhahiso e tloha Hopper ho ea Blackwell. Sebopeho se sebelisa leano le leholo la RDL hammoho le khokahano ea silicon e ngata.

• AMD Instinct MI300: Lihlopha tsa MI300 tsa AMD li kopanya chiplets tse ngata le I/O le li-stack tse leshome HBM. Phakete e sebelisa TSMC SoIC bakeng sa ho phahamisa li-chip tse phahameng hammoho le CoWoS bakeng sa ho kopanya ho eketsehileng ho se pakeng tsa phakete. Sena se bontša hore stack ea 3D le packaging ea 2.5D li ka kopanngoa ho processor e le 'ngoe.

• Broadcom 5 nm Data-Center ASIC: Broadcom e phatlalalitse 625 mm² 5 nm ASIC e sebelisang theknoloji ea TSMC CoWoS interposer le HBM2E, 112 Gbps SerDes, le khokelo e phahameng ea die-to-die. Setsi se ntse se etsoa bakeng sa data-center, AI, HPC, le setsi sa 5G.

Mehlala ena e bontša hore CoWoS e sebelisoa ka holimo ho AI GPUs. E boetse e ts'ehetsa HPC accelerators, ASICs e etselitsoeng AI, lisebelisoa tse amanang, le processors tse thehiloeng ho chiplet tse hlokang HBM le ho kopanya ho ngata.

CoWoS vs Likhopho tse Ling tse Ntšitsoeng tsa Packaging

CoWoS ke e 'ngoe ea theknoloji tse 'maloa tse ntlafalitsoeng tsa packaging tse sebelisoang ho khokahana le logic dies, HBM, le chiplets. CoWoS e ts'ehetsa meaho ea silicon-interposer, RDL, le hybrid RDL/local-silicon. Likhampani tse ling tsa packaging li sebelisa mekhoa e fapaneng ho fa khokahanong e phahameng ea die-to-die.

CoWoS vs Intel EMIB

Intel EMIB e sebelisa borai bo bonyenyane ba silicon bo kentsoeng ka hare ho substrate ea phakheje eseng ho ipapisetsa le interposer e kholo ka tlase ho bokhoni bo felletseng ba multi-die. Borai bana ba fa ketso e fokolang feela molaleng oa die e hlokang puisano e phahameng ka mor'a bokhoni.

EMIB e ka hokahanya logic ho logic le logic ho HBM interfase ha e fokotsa palo ea silicon e sebelisitsoeng bakeng sa ho khanna bohareng ba phakheje. Intel hape e fana ka EMIB-T, e eketsang TSV ho borai bo kentsoeng bakeng sa ho hokahana ha matšoao le matla a eketsehileng.

Phapang e kholo ke ho koahela ho khanna. CoWoS e ka fa ho khanna ha maemo a phahameng ho pholletsa le sebaka se seholo sa phakheje, ha EMIB e nka borai ba silicon ka mekhahlelo e khethiloeng ea interfase.

CoWoS vs TSMC InFO

TSMC InFO e sebelisa matšoao a phahameng a ho ferekanya ka hare ho sebopeho sa phakheje se fan-out. InFO-oS e beha die tse ngata tsa logic kapa chiplets ho sebopeho sa RDL le ho hokahanya borai ho substrate ea phakheje, ho lumella ho kopanya multi-die ntle le interposer e kholo ea silicon.

Ha e bapisoa le CoWoS, InFO e sebelisoa ho pota tsohle ka mefuta e pharaletseng ea phakheje moo mofuta wa sebopeho, ho kenyelletsa ho tlama, le litheko-ts'ebetso li bohlokoa. CoWoS e amanang haholo le phakheje e kholo ea AI le HPC e kopanyang logic e phahameng ka mohle le HBM e ngata.

CoWoS vs Samsung Cube

Leloko la Samsung Cube le sebelisa mekhahlelo e fapaneng ea silicon interposers, RDL, le meaho ea silicon e kentsoeng.

•2.5D Cube-S e beha die tsa logic le HBM ho interposer ea silicon. Samsung e bolela hore sethala sa Cube-S se netefalitsoeng se ts'ehetsa interposer ea silicon ea 3.3× e nang le logic e advanced le HBM e ka bang leshome.

•2.3D Cube-E e sebelisa interposer ea RDL e se nang TSV hammoho le borai bo kentsoeng ba silicon. RDL e sebetsana le ho khanna ho pharaletseng, ha borai ba silicon bo fa mekhahlelo e metle ho interfase e khethiloeng.

•2.3D Cube-R e sebelisa interposer e ipapisitseng le RDL ntle le interposer e felletseng ea silicon, e lumellang ho kopanya multi-die e kholo ka ho khanna ha metsi a ferekanyetsang.

Phapang e kholo lipakeng tsa Cube le CoWoS ke hore leloko ka bobeli le fa mekhahlelo e 'maloa ea ho lemoha ho khanna ha silicone le ho kopanya RDL e pharaletseng, leha meaho ea bona ea phakheje le mekhoa ea ho entseng e fapaneng.

CoWoS vs TSMC SoIC

SoIC ke mefuta e meng e amanang le 3D chip-stacking technology, ha CoWoS e fa hona ho kopanya ha 2.5D ho phakheje. SoIC e hokahanya die ka ho toba ka mokhoa o tletseng e kenang, ka boemo ba borai bo tlase ho 10 µm ho liphetho tse ling.

Theknoloji tse peli li entse ho ba tse amanang ho feta ho e-na le ho tšehetsa mohopolo o amanang ka moqoqo o amanang. Die tsa logic li ka ba li tšoanang pele li bokelloa ka SoIC ebe li kopanya le phakheje e kholo ea CoWoS hammoho le HBM kapa chiplets tse ling. TSMC e kenyelletsa kopano ena ho eona sethaleng se pharaletseng sa 3DFabric.

Ka kakaretso, phapang e kholo lipakeng tsa theknoloji tsena ke hore boemo bo phahameng ba mokhoa o amanang bo fumanoa: ho interposer e kholo, ka borai ba silikon bo loketseng, ka har'a ho ferekanya ha RDL, kapa ho toba lipakeng tsa die tse bokelletsoeng.

CoWoS Roadmap: Larger Packages, HBM4, and Scaling Challenges

Roadmap ea CoWoS e kenyelletsa sebaka se seholo sa interposer, die tse ngata tsa computation, HBM e eketsehileng, le theknoloji e ncha ea ho fa matla. Le faele ea roadmap e lokela ho arohana le theknoloji e netefalitsoeng kapa e se e hlahisoa ka bongata. Bolelele ba phakheje, palo ea HBM, le nako ea tlhahiso li lokela ho etsoa ho sebelisa lisebelisoa tsa morao-rao tsa TSMC pele ho phatlalatso.

Ntlha ea Roadmap	Boemo bo Balaea ka la Phato 2026
3.5-reticle CoWoS-L	Ho hlahisoa ka bongata ho tloha 2024
5.5-reticle CoWoS	TSMC e boletse ka Mots'eanong 2026 hore e ne e hlahisa boholo bona. Lihloohong tsa likamano tse ling li boletse ka 5.5-reticle CoWoS-L le tlhahiso e eketsehileng nakong ea 2026
9.5-reticle CoWoS	Ho phatlalalitsoe morero bakeng sa tlhahiso e ngata ka 2027, ka HBM e 12 kapa ho feta
14-reticle CoWoS	Ho phatlalalitsoe morero oa roadmap bakeng sa 2028, o hlalositsoeng joalo ka ho kopanya die tse kholo tse ka bang 10 le HBM e 20
Ka holim'a 14 reticles	Morero oa ka nako e telele bakeng sa 2029

Lisebelisoa tse Kholo tsa CoWoS

TSMC e re 3.5-reticle CoWoS-L e se e hlahiswa ka bongata ho tloha 2024. Ka Mots'eanong 2026, k'hamphani e boletse hore e hlahisa 5.5-reticle-size CoWoS le ho rera mehlolo e meng e meholo. Lihlooho tsa TSMC tsa 2025 Annual Report li hlalositse 5.5-reticle CoWoS-L joalo ka ho qeta netefatso ka 2026, ha karolo e 'ngoe e bolelloa hore netefatso e se e phethiloe 'me tlhahiso e ka baloa nakong ea 2026. Molaetsa ona o ka amahanya le mekhahlelo e meng e amanang le sethala, netefatso, kapa lihlahisoa tsa moreki, kahoo mantsoe a eona a pele a lokela ho bolokoa ho sa tsoa hlalosoa.

TSMC e phatlalalitse ka 2025 hore e rera ho hlahisa 9.5-reticle CoWoS ho hlahisoa ka litholoana ka 2027, e na le bokhoni ba ho feta 12 HBM stacks. Litemana tsa Symposium ea eona ea April 2026 li kenyelletsa le moralo oa 14-reticle, o hlahisitsoeng e le ho kopanya hoo e ka bang 10 large compute dies le 20 HBM stacks, ka tlhahiso e behiloeng ho 2028 le katoloso ho feta 14 reticles e builoeng ka 2029. Li-confgurations tsa 9.5-reticle le 14-reticle li ntse li le merero e phatlalalitsoeng kapa liphetho, eseng tlhahiso ea hajoale e tiisitsoeng.

HBM4 le Logic Base Dies

HBM4 e fetola ho feta stack ea mmeo. Die ea eona ea logic base e ka laola interface, taolo, le mesebetsi ea motho, e etsang hore theknoloji ea mmeo, ts'ebetso ea base-die, ho rothela ho interposer, le compute die li kopane hantle.

TSMC e se e kentse ka sechaba N12 le N3 logic base-die tharollo bakeng sa HBM4. Ka puisano ea theknoloji e latelang, e hlahisitse N12 bakeng sa meralo ea HBM4 le N3P bakeng sa meralo e ikhethileng ea HBM4E. Liphetho tsena li bontša ts'ehetso e behiloeng ke TSMC, empa ha li tiise hore kopanyo e 'ngoe le e 'ngoe ea HBM4 le CoWoS e se e phenile ngwanabo le ho kena tlhahiso.

Matla a Fana le Meeli ea Ho Pholosa

Ho eketsa sebaka sa sehlahisoa ho lumella ho kopanngoa ha logic le mmeo, empa hape ho phahamisa tšebeliso ea hona joale, boima ba nako, tšebeliso ea mocheso, le mathata a ho distibute matla. TSMC e se e lekanang ho fana ka matla le ho pholosa joalo ka meeli e meholo ho tsoela pele ho eketsa AI.

Khampani e hlahisitse li-capacitors tse laetsoeng, li-capacitors tse phahameng tsa MIM, le libeteri tse sebelisitsoeng joalo ka mekgwa ea ho ntlafatsa fono ea lehae le ho fokotsa ho simba ho feta. TSMC e boetse e phatlalalitse liphuputso tsa CoWoS tse sebelisang thepa e ntlafalitsoeng ea ho sebelisana le mocheso le liphetho tse bobebe bakeng sa mekgwa e nang le matla a ho pholosa ho fihla ho 2 kW. Tsena ke theknoloji le liphetho tse phatlalalitsoeng, eseng mekhahlelo e tiisitsoeng bakeng sa sehlahisoa se seng le se seng sa khoebo sa CoWoS.

Yield, Substrate, le Meeli ea Phello ea HBM

Pakete e kholo ea CoWoS e hloka litholoana, HBM stacks, sebopeho sa interposer kapa RDL, li-silicon tse sebelisang sebaka, substrate ea sehlahisoa, bumps, ho tlatsa, le mekhoa ea ho bokella ho fihlela meeli ea yield le ho ts'epahala. Ho eketsa sebaka sa sehlahisoa ho boetse ho eketsa palo ea li-interface le mehato ea tlhahiso e hlokang ho laoloa.

Naheng ea eona ea July 2026, TSMC e boletse hore bokhoni ba morao bo ntse bo le hlokeha. E boetse e buisane le bafani ba substrate ha e ntse e etsa mekhoa e meng ea ho paka. Sena se bontša hore ho eketsa tlhahiso ho itšetlehile ka ketane e felletseng ea phepelo eseng bokhoni ba ho bokella CoWoS feela.

Phetho ea HBM le tiisetso ea sehlahisoa e ka etsa meeli e eketsehileng hobane moralo o mong le o mong oa accelerator o hloka HBM stacks, logic base dies, ho rothela, fono ea matla, le meeli ea mocheso e lumellanang. Ho tloha ho HBM-count e phatlalalitsoeng ho hlalosa thuso e ka fihlelang, eseng ho tiisa hore sehlahisoa se teng.

Progress ea CoWoS roadmap e itšetlehile ka katleho ea theknoloji le tiisetso ea bareki, yield ea tlhahiso, availability ea substrate, HBM supply, power delivery, cooling, taolo ea warpage, le ts'epahalo e telele, eseng boholo ba sehlahisoa feela.